Surface-Tension Driven Heterogeneous Integration of Thin Film Photonic Devices Using Micro-Contact Printing for Multi-Material Photonic Integrated Circuits

Jing Xiao; Fuchuan Song; Sang-Woo Seo

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Surface-Tension Driven Heterogeneous Integration of Thin Film Photonic Devices Using Micro-Contact Printing for Multi-Material Photonic Integrated Circuits

機譯：用于多材料光子集成電路的微接觸印刷的薄膜光子器件的表面張力驅動異構集成。

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We introduce a surface-tension driven heterogeneous integration of thin film photonic devices using a surface wetting modification. In this process, the combination of a micro-contact printing method and plasma surface modification is used to selectively form a binding liquid on an integration host substrate. With predefined integration areas using the binding liquid, thin film GaAs photodetectors (PDs) are successfully integrated. We have demonstrated the implementation of this integration method by presenting a multi-material photonic integrated structure with integrated GaAs based thin film PDs and a polymer waveguide on a silicon substrate. The measured average misalignment of the integrated PDs was 2.8 μ m from the predefined integration locations. Stable electrical contact between the PDs and the host substrate has been confirmed with dark and photocurrent measurements. The proposed process has the potential towards a low-cost, parallel heterogeneous integration of III-V photonic devices on a silicon platform.

機譯：我們介紹了使用表面潤濕修飾的表面張力驅動的薄膜光子器件的異質集成。在該過程中，微接觸印刷方法和等離子表面改性的結合用于在集成主體基板上選擇性地形成粘合液。通過使用結合液的預定義集成區域，成功地集成了薄膜GaAs光電探測器（PD）。我們已經展示了一種集成方法的實現，該方法通過提出一種多材料光子集成結構，并在硅基板上集成基于GaAs的薄膜PD和聚合物波導。與預定義的集成位置相比，集成的PD的實測平均未對齊量為2.8μm。通過暗電流和光電流測量已經確認了PD與主機基板之間的穩定電接觸。所提出的工藝具有將III-V光子器件低成本，并行異質集成到硅平臺上的潛力。

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來源
《Lightwave Technology, Journal of》 |2011年第10期|p.1578-1582|共5頁
作者
Jing Xiao; Fuchuan Song; Sang-Woo Seo;
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Dept. of Electr. Eng., City Coll. of New York, New York, NY, USA;

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原文格式 PDF
正文語種 eng
中圖分類
關鍵詞
Heterogeneous integration; photodetector; polymer waveguide; surface tension; thin film photonic device;

機譯：異構集成;光電探測器;聚合物波導;表面張力;薄膜光子器件;
入庫時間 2022-08-17 13:03:29

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Surface-Tension Driven Heterogeneous Integration of Thin Film Photonic Devices Using Micro-Contact Printing for Multi-Material Photonic Integrated Circuits

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